IMS
High thermal performance PCBs used for discrete component Power Electronics applications and Power Lighting
IMB
Use of IMS in Power Semiconductors Electronics as Aluminium oxide DBC replacement:
• Equal or even lower Thermal Resistance than Aluminium oxide DBC
• Baseplate already integrated (no solder joint between circuit and baseplate)
• Wide copper thickness range availability
• Higher Mechanical strength than Aluminium oxide DBC
Both IMS (Insulated Metal Substrate) and IMB (Insulated Metal Baseplate) PCBs can be manufactured with more than one layer.
Typical Multilayer IMS and IMB stack-up:
• Multilayer section - Electrical connections by means of blind vias
• Insulation layer - Thermal Conductivity up to 10 W/mK, Breakdown Voltage up to 11 kVAC
• Baseplate - aluminum or copper, thickness from 0.5 to 3.0 mm
High copper thickness PCBs are used whenever high electric currents - up to some thousands A - are involved.
Main benefits in Bus Bar replacement application:
• High flexibility in design
• Possibility of components soldering
• Cost saving - especially for prototyping and low volumes
• Thin and homogeneous insulation between copper layers - reduced inductance
Serigroup Flex and Rigid-Flex PCBs production, both “flex to install” and “dynamic flex”, includes different applications such as:
• Power Electronics
• Battery pack connection and monitoring
• Power Lighting
• Connectors
Serigroup can offer almost all the types of FR4 PCBs manufactured with cutting-edge technology equipment such as:
• Direct Image Exposing for Dry Film Solder Mask
• Laser Drilling and Cutting
• Camera positioning in Drilling and Milling
SERIGROUP Srl
Via dell'Industria, 20 - 32010 Alpago (BL)
Italy